A laboratory for advanced chip packaging is close to completion at Da Nang Software Park No. 2, Báo Đà Nẵng's English edition reported on October 22.
The Advanced Semiconductor Packaging Laboratory, known as Fab-Lab, is being developed by VSAP LAB JSC with a total investment of 1.8 trillion dong. Construction covers more than 2,200 square metres, with over 5,700 square metres of floor space. The paper says it is expected to open soon but gives no date.
It combines a research laboratory, for packaging technologies such as FOWLP, 2.5D/3D IC and silicon interposers, with a fab area for pilot production on real wafers, equipped for lithography, wafer bonding, and testing and measurement. The planned output is 10 million products a year for domestic and overseas customers.
VSAP LAB describes the aim as bridging the gap between laboratory research and practical production. The report says the facility could help train skilled workers and support commercialising research if it builds links with universities and technology firms, and places it alongside the city's incentives for semiconductor and high-tech businesses.
Customers, staffing numbers and the production start date were not given.
Sources
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